Joerg Trodler, Hereaus Deutschland GmbH&Co.KG


Joerg Trodler is currently Senior Technical Manager at Heraeus. He is widely experienced in interconnection technology with an emphasis on interconnection materials i.e. solder paste for SMT and Wafer Bumping as well as SMT adhesive and conductive adhesive. Also, Joerg is experienced in integrated assembly technology for these materials, characteristics for the assembly process and transformation of test results to field conditions, test board level reliability, lead-free solders and assembly preconditions and reliability features and new interconnection technology and materials especially for high temperature applications for logic and power.

He has a Diploma Degree in Fine Mechanical Engineer and Electronic Equipment Techniques from the University of Applied Sciences to Berlin. In addition to his work at Heraeus he is Visiting Lecture for Reliability of electronic devices, University of Applied Sciences, Aschaffenburg. Prior to this, Joerg worked for Siemens AG as Project Engineer. Joerg has published a significant number of technical papers and has 17 patents attributed to him.