Dr. Swapan Bhattacharya received his M.S. and Ph.D. Degrees from the Indian Institute of Technology, India. He has been working in the area of microelectronics packaging for the past 15 years. He has coauthored numerous technical papers and offered short courses on Embedded Active and Passives in domestic and international conferences. He has served as an organizer of the ASME InterPACK and the Chair of the IEEE ECTC Technical Committee.