Mike Bixenman, Kyzen Corporation
Understanding the materials used to assemble LED chip on package is critical. Residue trapped next to interconnects can impact LED reliability when the LED is operated in humid environments. To gauge reliability as a function of cleanliness, the assembler needs documented evidence that the LED will perform over its expected life cycle.
The purpose of this designed experiment is to test the feasibility of a continuous innovation for testing the reliability of a LED assembled chip on package as it relates to environmental impacts and their electrical performance. The test method is designed to study the impacts from flux residue, cleanliness levels and for controlling the process.
Dr. Mike Bixenman (aka Dr. Mike) is known to many as the world's leading expert in cleaning electronic circuit assemblies and advanced packages. He is also one of the industry's leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).
A much sought-after presenter and global speaker, "Dr. Mike" has been featured on the cover of SMT Magazine and has published hundreds of industry white papers and cleaning hand books that are used around the world as today's leading applications references.
Despite all of Dr. Mike's hard-to-achieve industry recognition and demand, he is always approachable and ready to help engineers and technicians who need to improve their cleaning processes.
Dr. Mike' contributions to the electronic assembly industry have lead to multiple professional honors and recognitions, including the IPC President's Award and chairmanship of the IPC/SMTA Cleaning Symposium. Currently, he is chair of the IPC Cleaning Handbook Task Group. In addition to a Doctorate in Business Administration, Dr. Bixenman holds three other earned degrees.