1.) The newest advances in high speed reel-to-reel flip chip attach technology offer radical new opportunities. By using the newest approach for flip chip RFID-chips and adding an SMT-module for additional components, the solutions offers an unprecedented cost-of-ownership for the manufacturing of low- and mid-power LED applications. The technology is built on proven attach processes, which have been tested already in the bio over the last decade in the RFID market. The current wide web solution (up to 350mm) allows for flexibility and can handle different components and attach mechanism.
2.) In addition there are new novelty approaches to drastically reduce the cost of the needed substrate material. This manufacturing process uses off-the-shelf materials, is very clean (mechanical - not chemical) and allows for quick prototyping (new designs are done within hours). The cost-of-ownership for these substrates is only a fraction of standard substrates.
3.) A new direct-die-attach solution furthermore reduces the complexity of the chip attach solutions which allows for never seen before UPH chip attach volumes on flexible substrates. This solutions has been proven in other markets and opens a completely new approach to high-speed chip attach with reduced complexity & maintenance.
Gerald Steinwasser is the General Manager of Mühlbauer, Inc., a member of the German based Mühlbauer Group. Gerald has been with the company for more than nineteen years and has been focusing the last years mainly on the bare die applications, high-speed flip chip die sorting and R2R-production solutions. Other areas also involve smart card, ID-cards and e-passport and other government related solutions.
Prior to Mühlbauer, Gerald has been already working in the US for a medical company, Gambro Healthcare, where he was responsible for the 24/7 production of a highly automated injection molding department.
Originally from Germany, Gerald came to the US the first time in 1988 through an exchange program with the German military. Gerald graduated from the University of the German Armed Forces in Munich with a degree in aircraft- & aerospace technology.