Gyan Dutt, Alpha Assembly Solutions
Outdoor lighting systems based on high power LEDs have some of the most extreme reliability requirements due to high operating temperatures, ambient temperature excursions and long lifetime requirements. Interconnect thermal fatigue in these high power LEDs often results in poor thermal dissipation which increases the junction temperature and degrades the light output as well as the lifetime of the system.
In a study, high temperature operation of outdoor high power LED systems was simulated to study the high temperature stability of lead-free solders interconnects. The solder mechanical and microstructure characterization results were then correlated with creep resistance and thermo-cycling performance of interconnects in high power ceramic LED assemblies. Effect of flux systems on voiding was also investigated.
The paper will present the findings from this study and discuss the implications for interconnect selection on performance and reliability of high power LED systems.
Gyan Dutt works as Technical Marketing Manager for LED Business with Alpha Assembly Solutions. He is responsible for LED products portfolio management and Market Development. He has more than 15 years of experience in Technical Marketing, Applications Engineering and Product Development for Semiconductor Packaging and Electronics Assembly materials in the US and Asia-Pacific regions.
He co-chairs iNEMI roadmap on Solid State Illumination and also serves on SMTA Technical Commitee for LED Symposium. Gyan has a MS in Polymer Engineering from University of Tennessee, Knoxville and MBA from University of California Los Angeles.