on Tin Whiskers (2011)
September 14-15, 2011 Scope Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent. Tin whisker studies are being conducted by universities, companies and research organizations. Whisker research includes examining the fundamentals of whisker growth, the influence of the plating process, the influence of materials sets, the environmental stress drivers, methods for estimating whisker failure risk, and strategies for mitigating whisker failure risk. The goal of this symposium is to bring together the worlds experts, in the field of tin whiskers to discuss the state of research on tin whiskers. This symposium will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Attendees will be able to discuss the current state of knowledge on the growth, risk and mitigation strategies, whereby they can develop effective qualification and mitigation procedures for their products. All attendees are free to join us in this symposium. Attendee Registration for Web AccessPlease note, CALCE EPSC members can access these presentations with there existing Web Accounts. Contact Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Speaker Bios Presentations
Wednesday September 14th Michael Osterman, CALCE Electrical Failure of an Accelerator Henning Leidecker, NASA Sungwon Han, CALCE Anduin Touw, Boeing Elizabeth N. Hoffman, Savannah River National Laboratory Donald F. Susan, Sandia National Labs Nick Clore, Purdue University Jendrik Stein, Robert Bosch Controlling Direction of Strain Energy Driving Forces Responsible for Whisker Growth The Role of Ionic Contamination and
Tin Oxide Interactions in Tin Whisker Initiation Whisker-Impenetrable Metal Cap
Process for Electronic Assemblies Gordon Davy, Thursday September 15th Evaluation of Conformal Coating for Mitigation of Tin Whisker Growth Tsuyoshi Nakagawa, Nippon Avionic Co. Adhesion and Puncture Strength of Conformal Coating Used to Mitigate
Tin Whisker Growth Yong Sun, CALCE |