4rd International Symposium on Tin Whiskers (2010)

June 23-24, 2010

Sameual Riggs IV Alumni Center
University of Maryland
College Park, MD


Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent. Tin whisker studies are being conducted by universities, companies and research organizations. Whisker research includes examining the fundamentals of whisker growth, the influence of the plating process, the influence of materials sets, the environmental stress drivers, methods for estimating whisker failure risk, and strategies for mitigating whisker failure risk. The goal of this symposium is to bring together the worlds experts, in the field of tin whiskers to discuss the state of research on tin whiskers. This symposium will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Attendees will be able to discuss the current state of knowledge on the growth, risk and mitigation strategies, whereby they can develop effective qualification and mitigation procedures for their products. All attendees are free to join us in this symposium.

Organized by

Center for Advanced Life Cycle Engineering (CALCE)
The Institute of Scientific and Industrial Research (ISIR), Osaka University


Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Prof. Michael Pecht, CALCE, University of Maryland, pecht@calce.umd.edu
Dr. Katsuaki Suganuma, ISIR Osaka University, Japan, suganuma@sanken.osaka-u.ac.jp

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Day I-Session I
Welcome / Introduction
Michael Osterman, CALCE
Tin Whisker Mitigation Project of JEITA
Prof. Katsuaki Suganuma (Osaka University)
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development: Model and Experiments
P.T. Vianco and J.A. Rejent (Sandia National Laboratories)
Mechanism of Growth of Tin Whiskers/Hillocks by Studying the Underlayer Effect Using FIB Technology
Jing Cheng and James Li (University of Rochester) and P.T. Vianco (Sandia National Laboratories)
Real-time Studies of Whisker Growth : Trying to Understand the Stress, IMC and Whisker Connection
Prof. Eric Chason, Nitin Jadhav, Eric Buchovecky, Allan Bower and Sharvan Kumar (Brown University)
Day I-Session II
Effect of Sn modification on Stress, IMC growth and Whisker kinetics: Thickness Grain Size Pb Alloying Annealed and Reflowed
Nitin Jadhav and Eric Chason (Brown University) and Gordon Barr (EMC Corporation)
Effect on Whisker Growth of Crystallographic Texture in Sn, Sn-Cu and Sn-Cu-Pb Films Synchrotron Micro-Diffraction Investigation
Pylin Sarobol, Aaron Pedigo, John Blendell, Carol Handwerker (Purdue University) and Peng Su and Jie Xue(Cisco)
Effects of Pb on the Diffusion of Tin within Tin Platings
Dr. Tom Woodrow (Boeing)
Day I-Session III
Tin Whisker Growth and the Structure Zone Model for Electroplated Tin
Aaron Pedigo, Pylin Sarobol, John Blendell, and Carol Handwerker (Purdue University)
SEM Observation and EBSD Analysis of Straight and Kinked Sn Whiskers
Donald Susan, Joe Michael, Dick Grant, Graham Yelton and Bonnie McKenzie (Sandia National Laboratories), Edward Webb III (Lehigh University),
Pressure Induced Whisker Formation
Michael Osterman, CALCE (University of Maryland)
Day I-Session IV
Effect of Soldering Method and Flux Type on Tin Whisker Growth
Keith Howell, K. Sweatman, J. Masuda, T. Nozu, M. Koshi and T. Nishimura (Nihon Superior)
Effects of Reflow Atmosphere and Flux on Sn whisker Growth of Sn-Ag-Cu Solders
Minoru Ueshima (Senju Metal Industry Co., Ltd.) Alongheng Baated, Keun-Soo Kim and Katsuaki Suganuma (Institute of Scientific and Industrial Research, Osaka University) Sharon Huang, Benjamin Jurcik and Shigeyoshi Nozawa (Air Liquide Laboratoires)
Minimization of Tin Whisker Growth for Ultra-low Tin Whisker Applications
Bill Sepp and Rob Schetty (Technic Inc.)
Tin whisker test results for PCB test coupons with immersion tin surface finish
Martin H., Natcharee N., Pakamas N. (Celestica)
Day II- Session I
Tin Reflow for Tin Whisker Mitigation
Dr. George Chou and Dr. Robert Hilty, Tyco Electronics
Tin Whisker Mitigated by Photonic Sintering for Sn-based Surface Finishes
Mohshi Yang, James P. Novak, and David Jiang (Applied Nanotech, Inc. ) Lyudmyla Panashchenko (CALCE/NASA GSFC) Ahmed Amin (CALCE), Michael Osterman (CALCE)
Whisker Bridging Risk Spacing Analysis of the Back Side of Quad Flat Packs
Stephan Meschter and Anthony Olenik BAE Systems
Application-Specific Tin Whisker Risk Assessment Algorithm- Update 2010
Risk Algorithm Spreadsheet (Rev D Beta)
David Pinsky (Raytheon)
Day II -Session II
Results of Mitigation Effectiveness Survey & Plans for GEIA-STD-0005-2 Revision
Anduin E. Touw (Boeing)
Evaluation of Conformal Coating for Mitigation of Tin Whisker Growth (Part II)
Tsuyoshi Nakagawa (Nippon Avionics Co.,Ltd.) Toshiyuki Yamada (Avionics Fukushima Co.,Ltd.) Norio Nemoto (Japan Aerospace Exploration Agency) Katsuaki Suganuma (Osaka University)
Tin Whisker Growth on Conformally Coated SnPb Assemblies
Sungwon Han and Michael Osterman (University of Maryland)
Day II -Session III
Developing Measuring the mitigation capability of Conformal Coatings: Part 2
Dr. Chris Hunt and Martin Wickham (NPL)
Metal Vapor Sparking and Arcing
Dr. Henning Liedecker, Jay Brusse, Lyudmyla Panashchenko (GSFC NASA)
Tin Whisker Evaluation Status for Space Application
Norio Nemoto, Japan Aerospace Exploration Agency (JAXA) Tsuyoshi Nakagawa, Nippon Avionics co.,ltd Toshiyuki Yamada, Avionics Fukushima co., ltd Katsuaki Suganuma, Osaka University
Tin Whisker Lead free Electronics Risk Reduction Program
Manhattan SME’s... Carol Handwerker, Dave Pinsky, Tom Woodrow Craig Hillman, Dave Humphrey, Maureen Williams and Mike Osterman

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