June 23-24, 2009
Technical Unversity of Denmark
Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent. Tin whisker studies are being conducted by universities, companies and research organizations. Whisker research includes examining the fundamentals of whisker growth, the influence of the plating process, the influence of materials sets, the environmental stress drivers, methods for estimating whisker failure risk, and strategies for mitigating whisker failure risk. The goal of this symposium is to bring together the worlds experts, in the field of tin whiskers to discuss the state of research on tin whiskers. This symposium will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Attendees will be able to discuss the current state of knowledge on the growth, risk and mitigation strategies, whereby they can develop effective qualification and mitigation procedures for their products. All attendees are free to join us in this symposium.
Center for Advanced Life Cycle Engineering (CALCE)
The Institute of Scientific and Industrial Research (ISIR), Osaka University
Technical University of Denmark
Surface Mount Technology Association
Dr. Michael Osterman, CALCE, University of Maryland, firstname.lastname@example.org
Prof. Michael Pecht, CALCE, University of Maryland, email@example.com
Dr. Katsuaki Suganuma, ISIR Osaka University, Japan, firstname.lastname@example.org
Dr. Rajan Ambat, Technical University of Denmark, email@example.com
Melissa Serres Marx, Surface Mount Technology Association, firstname.lastname@example.org
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