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Abstract

Semiconductor packaging manufacturing processes utilize thermosets, filled with inorganic fillers (e.g., silica particles), to encapsulate and protect semiconductor chips. Compression molding is more frequently employed for advanced semiconductor packaging products, which involve curing filled thermosets under high-temperature, high-pressure conditions. Accurate prediction of mechanical behavior after molding is critical for optimizing high-temperature/pressure manufacturing processes, especially for advanced semiconductor packaging technologies such as Fan-out wafer- and panel-level packaging (FO-WLP/PLP) and heterogeneous integration (HI) involving 2.5-D/3-D stacked integrated circuits (ICs).

This seminar presents a novel prediction scheme to simulate the entire compression molding process, including demolding and post-molding. The model incorporates all critical properties required for prediction, including (1) chemical and diffusion-controlled cure kinetics, (2) cure-induced shrinkage after the gel point, and (3) cure-extent-dependent viscoelastic Young's and bulk viscoelastic properties. Predictions of warpage under various molding parameters are presented, and their applications to package reliability are discussed.

Dr. Sukrut P. Phansalkar received a Bachelor of Technology (BTech) and a Master of Technology (MTech) in Thermal Engineering from the Indian Institute of Technology, Kharagpur, in 2018. He received his Ph.D. degree in Mechanical Engineering from the University of Maryland in August 2024, under the guidance of Prof. Bongtae Han.

Dr. Phansalkar is currently a postdoctoral researcher at the Laboratory for Optomechanics and Micro/nano Semiconductor Systems (LOMSS), one of CALCE's research laboratories. His research has focused on the characterization of the nonlinear mechanical behavior of polymers and related modeling techniques. He has published 10 journal papers and 18 conference proceedings. He has received (1) ECTC Student travel award in 2024, (2) Irwin Centennial Research Award in 2022, and (3) Dean's research fellowships in 2022 and 2020.

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