Soldering Processes and Equipment
Created: 5/21/95 Updated: 2/5/98
Soldering Processes and Equipment
edited by M. Pecht
John Wiley & Sons, New York, NY, July 1993

In the last three decades, soldering technology has developed from an art into a high-technology science an evolution chiefly influenced by the pressure placed on the soldering industry by advances in microelectronics. This book addresses the major facets of modern soldering technology and the science behind that technology. It defines soldering and solder joints and describes the various steps involved in soldering different types of printed circuit and wiring boards, presents an overview of soldering in terms of various alloys, fluxes, and pastes used in soldering, and discusses the issues related to intermetallics and contaminants. Both wave soldering and reflow soldering processes including, fluxing, preheating, dispensing, screen printing, pin transfer, the various solder waveforms, controlled atmospheres, and heat transfer methods for reflow are discussed at length. Cleaning of soldered assemblies and the issues concerning the elimination of CFC-based solvents are detailed. One full chapter is dedicated to the quality and reliability of solder joints with an emphasis placed on the physics-of-failure approach to reliable soldering. Repair and rework operations performed on through-hole, as well as surface-mount, devices are described with guidelines provided for component selection and assembly techniques. An appendix listing various solder equipment manufacturers and a glossary of soldering terms is included.

July 1993, 296 pages, ISBN: 0-471-59167-X
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