Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Created: 5/21/95 Updated: 2/5/98
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
edited by Michael Pecht, Abhijit Dasgupta, John Evans, and Jillian Evans
John Wiley & Sons, New York, NY, 1994

"...examination of the root causes of failures..." EP&P Book Reviews
Qualification and quality conformance are techniques for auditing the reliability of a product's design and manufacturing process. For a complex, interconnected microelectronic module, the procedures for these techniques must be considered early in the design cycle. This book addresses the role of failure-mechanism identification and modeling as a science-based approach to developing a qualification and quality conformance program. The various chapters present the major package and interconnect elements in a sequence compatible with the information flow for design assessment, manufacturing-process quality conformance, and qualification. The book discusses the general function, purpose, and configurations of the active elements, interconnects, and assembly technology being assessed, key materials and critical properties, representative manufacturing- process flows, potential failure mechanisms, and qualification procedures. Potential high-risk manufacturing and qualification problems are emphasized, as well as issues associated with ongoing quality assurance.
Internationally recognized experts from industry and academia have made an important contribution to this book, which brings together the knowledge base crucial for the assessment of reliable microelectronic packages.

March 1994, ISBN: 0-471-59436-9
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