Semiconductor Packaging<br>A Multidisciplinary Approach
Created: 5/21/95 Updated: 2/5/98
Semiconductor Packaging
A Multidisciplinary Approach
edited by A. Kraus, R. Hannemann and M. Pecht
John Wiley & Sons, New York, NY, 1994

In this book, academic researchers, graduate students, and practicing mechanical, electrical, and materials engineers will find all the essentials required to master the packaging and interconnection of microelectronic components. Providing thorough coverage of the interdisciplinary and interfunctional issues that come with the territory, the authors...

ISBN: 0-471-53299-1
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