Created: 4/29/09

Encapsulation Technologies for Electronic Applications

Haleh Ardebili and Michael Pecht

More than 99% of today’s microelectronic devices are encapsulated in plastic. Recent improvements in materials and cost incentives have expanded the application boundaries for plastic electronic packages so that many electronic applications once enclosed hermetically are now enclosed in commercial-off-the-shelf (COTS) packages. The obvious advantages are low cost, smaller form factors, and improved manufacturability.

Encapsulation Technologies for Electronic Applications is primarily focused on the encapsulation of microelectronic devices, with additional attention paid to the encapsulation of connectors and transformers. Various encapsulation techniques are explained including molding, potting, glob-topping, underfilling and printing encapsulation. Other topics discussed include 2-D and 3-D packaging, materials (including those considered to be environmentally friendly or “green”), properties and characterization. Furthermore, this book addresses the defects and failures related to encapsulation, how to properly analyze them, and how to apply proper quality assurance and qualification processes. It also provides up-to-date information on the trends and challenges of encapsulation and microelectronics packages, including in the application of nanotechnology.


Dr. Haleh Ardebili has an Honors BS degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience at General Electric Global Research Center at Niskayuna, New York. She teaches and conducts research at the University of Houston in Mechanical Engineering.

Prof. Michael Pecht has an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is the founder of CALCE Center at the University of Maryland, College Park, where he is also a Chair Professor in Mechanical Engineering and also a Professor in Applied Mathematics. He has written more than twenty books on electronic products development, use and supply chain management and over 400 technical articles.

ISBN: 978-0-8155-1576-0
William Andrew
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