E. Bumiller, D. Douthit, J. Pecht, M. Pecht
CRC Press, Boca Raton, FL
New components, designs, materials, and assembly processes have caused contamination problems to become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has thus become necessary for increasing quality and reliability, and reducing the costs of electronic assemblies.
The purpose of this book is to address contamination issues in electronic products, with enough information to direct someone into the correct area with the ability to ask questions and understand answers for viable identification, mitigation, and management. This book is intended to be a guide to solve problems. It takes a step-by-step approach to identify the contaminants encountered at each level of processing and their detrimental effects on electronic products. The book discusses contamination of electronic assemblies from the manufacture of the glass fibers used in the laminates to the complete assembly of the finished product. Defects that are encountered during the manufacturing process are targeted, and the contaminants that cause defects and how these defects can be reduced by detection and control methods are discussed. Tables, figures, and fishbone diagrams serve as a quick reference to help engineers familiarize themselves with the origination, detection, measurement, control, and the prevention of contamination on electronic assemblies.
Engineers employed in companies ranging from the laminate manufacturers to the end users can find a multitude of uses for the information and references contained in these pages. Among those most likely to find this information useful are:
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