CALCE EPS Consortium Research for 2024
The following proposals are under review for adoption for 2024.
| ID | Title |
| C24-03 | Effect of Aging and Recrystallization on Performance of Oligocrystalline SAC Solder Joints |
| C24-07 | Reliability of 3rd Generation Lead-free Solder Interconnects |
| C24-08 | Reliability of Low Temperature Solder Interconnects |
| C24-10 | Development of Advanced Board Level Reliability Prediction Model for Power Devices under Autonomous Driving Condition |
| C24-15 | Development of Derating Guidelines for Lithium Ion Batteries |
| C24-19 | Evaluation of Multilayer Ceramic Capacitors MLCCs for Use with Ripple Current Continuation of C23-19 |
| C24-22 | Fretting Wear and Lubrication of Polymer/Metal Contacts Continuation of C23-22 |
| C24-25 | Development of a PHM Methodology for Printed Circuit Board Assemblies |
| C24-26 | Paint Delamination and Scratch Resilience for Electronic Products |
| C24-30 | Guidelines for Storage of Printed Board Assemblies and Electronic Equipment |