CALCE EPS Consortium Research for 2027
The following project are being conducted for 2027.
| ID | Title |
| C27-03 | Microstructure sensitive Reliability Assessment for PHM Digital Twins of HI Interconnects |
| C27-07 | Thermal Cycle Fatigue Life Models and Wafer-Scale Package Tests for Lead-free High-Performance Solder Interconnects |
| C27-08 | Thermal Cycle Fatigue Models and Mechanical Shock Reliability of Low-Temperature Solder Interconnects |
| C27-11 | High-Density Interconnect (HDI) Laminate Reliability Concerns |
| C27-15 | Reliability Prediction Framework Development and Demonstration |
| C27-19 | A Structure-Properties-Reliability Analysis of Multilayer Ceramic Capacitors (MLCCs) for Improved Part Selection |
| C27-22 | Predictive Modeling of Wear in Lightly Loaded Fretting Contacts |
| C27-23 | Time Domain Reflectometry Analysis of Conductive Traces Produced Using Silver Ink |