CALCE EPS Consortium Research for 2026
The following project are being conducted for 2026.
| ID | Title |
| C26-03 | Microstructure-sensitive Reliability Assessment for PHM Digital-Twins of HI Interconnects |
| C26-07 | Thermal Cycle Reliability Models for Lead-free High-Performance Solder and Wafer Level Packages Solder Interconnect Tests |
| C26-08 | Reliability of Low-Temperature Solder Interconnects |
| C26-11 | High-Density Interconnect (HDI) Laminate Reliability: Technology Status and Implementation Concerns |
| C26-19 | Ripple Current Testing of Multilayer Ceramic Capacitors (MLCCs) for Correlation with Selection Criteria |
| C26-20 | Rapid Assessment of Electronic Assemblies Using Side-Channel Power Modulation Analysis |
| C26-22 | Modeling and Physical Analysis of Lubrication in Lightly Loaded Contacts Undergoing Fretting |
| C26-26 | Coating Durability in Electronic Products |