CALCE EPS Consortium Research for 2015

The following projects were presented to the CALCE EPS Consortium Members on October 23, 2014 and have been approved for study during the 2015 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Michael Osterman.

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C15-01 Effect of Temperature Excursions on Harmonic Vibration Fatigue
C15-02 Effects of Frequency Ratio and Phase Relationship on Multiaxial Vibration Fatigue
C15-07 Interconnect Reliability of Corner-bonded Surface Mount Part
C15-08 Evaluation of Novel Conformal Coatings for Tin Mitigation
C15-09 Comparative Study of SACBi Solder Interconnects
C15-11 Damage State Estimation in Solder Interconnects under Sequential Loading Conditions
C15-12 Cyclic Fatigue and Viscoplastic Behavior of High-Temperature Sintered Silver Interconnect Materials
C15-15 Degradation of Pressure Sensitive Adhesives under Hygro-thermo-mechanical Aging
C15-16 Cyclic Fatigue of Selected High-Temperature Solders
C15-17 TLPS Assembly-Level Joining Materials for High Temperature Reliability
C15-18 Moisture Sensitivity of MnO2 Tantalum Capacitors
C15-19 Life Estimation for Tantalum Capacitors with Conductive Polymer Electrolytes
C15-20 Degradation of Glass/Epoxy Interfaces in Printed Circuit Boards
C15-22 Correlation between fretting wear and scratch resistance of gold connectors
C15-23 Effectiveness of End of Line Tests for Electronic Systems
C15-25 POF Models for Delamination in Electrical Interconnects
C15-27 Accuracy of Thermal Cycle Fatigue Prediction Using Rainflow Counting
C15-29 SARA Software: MCM Modeling Update
C15-31 Warpage Prediction Strategy Using Advanced Viscoelastic Modeling
C15-32 Enhancement of Portable Moire System for Microscopic Thermal Deformation Analysis
C15-35 Effect of Assembly Warpage on Durability of SMT Leaded Interconnects
C15-36 Drop Testing of Large Footprint SMT Devices: SIM and SD Card Readers