CALCE EPS Consortium Research for 2015
The following projects were presented to the CALCE EPS Consortium Members on October 23, 2014 and have been approved for study during the 2015 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Michael Osterman.
Members ViewC15-01 | Effect of Temperature Excursions on Harmonic Vibration Fatigue |
C15-02 | Effects of Frequency Ratio and Phase Relationship on Multiaxial Vibration Fatigue |
C15-07 | Interconnect Reliability of Corner-bonded Surface Mount Part |
C15-08 | Evaluation of Novel Conformal Coatings for Tin Mitigation |
C15-09 | Comparative Study of SACBi Solder Interconnects |
C15-11 | Damage State Estimation in Solder Interconnects under Sequential Loading Conditions |
C15-12 | Cyclic Fatigue and Viscoplastic Behavior of High-Temperature Sintered Silver Interconnect Materials |
C15-15 | Degradation of Pressure Sensitive Adhesives under Hygro-thermo-mechanical Aging |
C15-16 | Cyclic Fatigue of Selected High-Temperature Solders |
C15-17 | TLPS Assembly-Level Joining Materials for High Temperature Reliability |
C15-18 | Moisture Sensitivity of MnO2 Tantalum Capacitors |
C15-19 | Life Estimation for Tantalum Capacitors with Conductive Polymer Electrolytes |
C15-20 | Degradation of Glass/Epoxy Interfaces in Printed Circuit Boards |
C15-22 | Correlation between fretting wear and scratch resistance of gold connectors |
C15-23 | Effectiveness of End of Line Tests for Electronic Systems |
C15-25 | POF Models for Delamination in Electrical Interconnects |
C15-27 | Accuracy of Thermal Cycle Fatigue Prediction Using Rainflow Counting |
C15-29 | SARA Software: MCM Modeling Update |
C15-31 | Warpage Prediction Strategy Using Advanced Viscoelastic Modeling |
C15-32 | Enhancement of Portable Moire System for Microscopic Thermal Deformation Analysis |
C15-35 | Effect of Assembly Warpage on Durability of SMT Leaded Interconnects |
C15-36 | Drop Testing of Large Footprint SMT Devices: SIM and SD Card Readers |