Abstract:

Mixed flowing gas (MFG) testing is used to demonstrate the ability of an electronic product or system to survive use in a corrosive environment. Mixed flowing gas (MFG) testing is designed to corrode copper and silver which is often used electronic products. However, MFG tests have failed to identify failure issues in recent years. These failures have been predominately related to the corrosion of silver. To understand these test escapes, tests examining silver and copper corrosion under MFG have been conducted. These test results shows that the rate of copper and silver corrosion is not equivalent and varies based on gas concentration and may explain the failure escapes.