Sukrut Prashant Phansalkara, Yongrae Janga, Bongtae Hana, Ran Taob, and Aaron M. Forsterb
aDepartment of Mechanical Engineering, University of Maryland, College Park, Maryland, USA
bMaterial Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, USA
For more information about this article and related research, please contact Prof. Bongtae Han.
Abstract:
Analysis of the cure kinetics of dual-reaction thermosets requires the determination of nine constants including the ratio of the first reaction to the total reaction. Simultaneous determination of the nine constants from experimental data is extremely challenging because an objective function to determine the constants through regression analyses is a sum of two highly non-linear kinetic functions. This paper proposes a novel method to determine all nine constants accurately and consistently using minimum testing data. The method first utilizes a model-free analysis for the ratio. An analytical least-squares approach is followed for the remaining eight model constants of dual reactions. The method is implemented for a highly-filled dual-reaction epoxy-based underfill commonly used in advanced semiconductor packaging applications. The proposed method is remarkably efficient; it requires data from only two standard DSC dynamic scans to determine then ine constants accurately. The robustness and accuracy of the proposed method are corroborated experimentally.
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