Vivek Manepalli1, Rachel McAfee1,2, Andoniaina M Randriambololona1, Samuel Graham1, and Damena Agonafer1
1Department of Mechanical Engineering, University of Maryland, College Park, Maryland, USA, 20742
2DEVCOM Army Research Laboratory, Adelphi, MD, USA, 20783
For more information about this article and related research, please contact Prof. Damena Agonafer.
Abstract:
Silicon carbide (SiC) devices are increasingly favored in modern power modules, enabling significant size reductions while supporting higher power densities, resulting in heat fluxes exceeding 400 W/cm². However, the time-varying loads typical in many applications induce substantial temperature cycling, posing thermo-mechanical challenges that necessitate cooling systems capable of handling peak loads. This study introduces a novel hybrid thermal management approach employing a three-component composite phase change material (PCM) integrated with standard liquid cooling to mitigate temperature cycling, lower peak junction temperatures, and extend the lifespan of power modules. The proposed PCM composition combines Field's metal (FM) with micro-encapsulated organic PCM (MEP) embedded within a graded porous honeycomb structure in the copper baseplate of the module. Transient thermal modeling is done under various time-varying loads and electric vehicle drive cycles, examining the effects of different times and duty factors. Results show a maximum temperature cycling reduction of 13.3% and 13.9% at heat transfer coefficients of 3000 W/m².K and 4000 W/m².K, respectively, compared to a power module with no PCM. Correspondingly, a power module lifecycle improvement of 120.1% and 112.5% is observed under these conditions. Thicker PCM-integrated baseplates improved transient performance due to higher thermal capacitance despite greater resistance. Additionally, FM-dominated PCM, with higher volumetric energy density, outperformed MEP-dominated PCM. These findings underscore the potential of a three-component composite PCM in power modules for superior transient thermal management and enhanced module durability.
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