Thermal management in high performance electronics has become a leading challenge for design and reliability engineers. Harsh temperatures can be caused either by harsh operational conditions (high power dissipation), or by harsh environmental conditions. Both require adequate thermal management to ensure that the product temperature stays within acceptable limits. High temperature, significant cyclic excursions of temperature, strong temperature gradients, and rapid temperature transients, can cause multi-physics degradation to electronic/photonic systems (including components, substrates, and interconnects), leading to progressive aging, degradation of system performance and eventual failure...

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