Michael Osterman and Aaron Mendelsohn
Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, 20742, USA
For more information about this article and related research, please contact Michael Osterman.
Abstract:
Solder interconnects are required to provide low resistance connections between terminals of packaged devices and printed boards over the expected life. Thermal cycling fatigue is one of the main reliability concerns for solder. For the introduction of low temperature solders with reflow peak temperatures below 200℃, their thermal cycle fatigue life must be characterized. This paper presents a multiple component type test and time to failure data for solder interconnects formed with low temperature solders for BGAs, QFNs, and SMR component types.
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