Lei Sua, Xinfang Duana, Jiefei Gua, Xinwei Zhaoa, Ke Lia, and Michael Pechtb
aJiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology, School of Mechanical Engineering, Jiangnan University, Wuxi 214122, China
bCenter for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA
For more information about this article and related research, please contact Prof. Michael G. Pecht.
Abstract:
To achieve effective detection of loose particles within small cavities in microelectronic devices, this paper proposes the optimal detection conditions of loose particles in ceramic packaging for microelectronic devices based on simulation, and presents a method for weak signal reconstruction using weighted sparse representation. To address the challenge of ineffective detection of loose particles under recommended vibration conditions, a particle-cavity collision dynamics model is established. Subsequently, the detection laws of loose particles under different accelerations, frequencies, and cavity heights are studied through simulation, leading to the establishment of optimal detection conditions for microelectronic devices with varying cavity heights. To address the issue of weak impulses being submerged in background noise under optimal detection conditions, sparse representation is utilized for signal reconstruction. First, a Laplace wavelet dictionary is constructed according to the impulse characteristics. Second, the generalized minimax-concave (GMC) penalty function is applied as a sparse regularization term to preserve signal amplitude. Meanwhile, a weight matrix based on kurtosis and singular value is designed to threshold sparse coefficients. The results demonstrate that the proposed optimal detection conditions and signal reconstruction method effectively detect loose particles. Compared with other algorithms, the proposed method reduces background noise in the particle impact noise detection (PIND) signals while maintaining impulse amplitude; it also improves signal reconstruction accuracy and offers valuable insights into effective loose particle detection in microelectronic packaging devices.
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