2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 2093-2100, DOI: 10.1109/ECTC51909.2023.00358

Time-dependent Bulk Behavior of Cured Epoxy Molding Compound

Sukrut Prashant Phansalkar1, Roshith Mittakolu1, and Bongtae Han1
1Mechanical Engineering Department, University of Maryland, College Park, MD, USA

For more information about this article and related research, please contact Prof. Bongtae Han.


A unique hydrostatic testing setup to measure time-and-temperature dependent hydrostatic strains of EMC is developed and implemented. The setup can apply hydrostatic pressure to an EMC coupon at any preset rates at a wide range of temperatures using He gas. In this study, a linear ramp of pressure application is employed to avoid heat generation associated with instant pressure application used in the previous attempt. The time-and-temperature dependent bulk moduli are determined by solving the hereditary integral equation using the pressure and hydrostatic strain history document during testing. This procedure requires a short testing time, which is ideally suited to measurements of the viscoelastic bulk behavior of partially cured EMC.

This article is available online here and to CALCE Consortium Members for personal review.

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