SMTA International, 2023, Minneapolis, MN

Investigation into Low Temperature Solder Reliability


Michael Osterman and Aaron Mendelsohn
Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, 20742, USA

For more information about this article and related research, please contact Michael Osterman.

Abstract:

Low temperature solders are currently being used in the portable computer industry and will continue to expand into other industries. As a critical component for electronic products, it is important to understand their reliability. With regards to reliability, thermal cycling and drop performance are important metrics in establishing reliability. This paper presents an examination of three low temperature solders and provides a comparison with tin-silver-copper solder. The test vehicle includes SAC305 BGAs, QFNs, and SMR packages. Current test plan and test results are presented.

This article is available online here and to CALCE Consortium Members for personal review.

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