2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1319-1326, DOI: 10.1109/ECTC51909.2023.00225

Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction

Ran Tao1, Sukrut Prashant Phansalkar2, Aaron M. Forster1, and Bongtae Han2
1Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, USA
2Department of Mechanical Engineering, University of Maryland, College Park, MD, USA

For more information about this article and related research, please contact Prof. Bongtae Han.


Cure kinetics of epoxy molding compounds (EMCs) is a fundamental material property that affects the molding process of semiconductor chips and final package performance. However, due to measurement challenges related to the small polymer fraction, only the main reaction is considered in the current industry practice for EMC cure kinetics evaluation. In this work, we show that a second reaction exotherm is clearly identified in commercial multi-resin EMC systems upon dynamic heating scan using differential scanning calorimetry (DSC). The second reaction completes the overall reaction from about 0.8 to 1.0 fractional conversion, which is critical for designing cure schedules to achieve ultimate properties, especially the post-mold curing (PMC) procedure during manufacturing.

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