Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 17 April 2023, DOI: 10.1109/EuroSimE56861.2023.10100850

Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly

Aniket Bharamgonga ¹^*, Dr. Abhijit Dasgupta ¹, Dr. Abhishek Deshpande ¹, Torsten Hauck ², and Yaxiong Chen ²
¹ Center for Advanced Life Cycle Engineering, University of Maryland, College Park, USA.
² NXP Semiconductors

For more information about this article and related research, please contact Prof. Abhijit Dasgupta.

Abstract:

SAC solder joints contain a few large grains and are hence termed oligocrystalline. Solder joints represent heterogeneous anisotropic behavior which affect durability of solder joint during thermal and mechanical loading conditions. In this paper, variability in durabiity of solder joints under cyclic mechanical bending of CSP assemblies was studied. A global 3D slice model of CSP package was used anddisplacement were transferred to a more detailed local model of the critical solder joint, using a submodeling approach. Further simulations were conducted on this critical CSP joint. Local model results were compared with global model.

This article is available online here and to CALCE Consortium Members for personal review.