Gilad Nave and Patrick McCluskey
Department of Mechanical Engineering, University of Maryland, College Park, MD, USA
For more information about this article and related research, please contact Prof. Patrick McCluskey
As part of the effort to implement additive manufacturing techniques into the world of power electronics devices and materials that can operate at harsh environments, researchers and industry must mitigate multi-level challenges that span processing techniques, manufacturing scaling, manufacturing mobility, cost reduction, optimal material properties, and reliable material performance. This study presents a new method to dynamically test the electrical properties of a given solder alloy. The method is capable of testing the electrical properties from the moment in which the solder is pasty and mixed with multiple organics, to the point where the organics are evaporated and reacted, and the remaining material is only diffused metal powder. This new testing method allows to quantify multiple effects such as organic–metallic interactions, chemical effects, metallurgical effects, and in the context of additive manufacturing, this testing method provides a new design tool for faster processing, temperature profiles designs, and paste formulation design.
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