23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, pp. 1-7, DOI: 10.1109/EuroSimE54907.2022.9758900.

Virtual Testing and Digital Twin Approaches for Response of Grain-scale Solder Interconnects to Multiaxial Loading

Torsten Hauck1, Michiel Van Soestbergen1, Qian Jiang2, Abhishek Deshpande2, Aniket Bharamgonda2, and Abhijit Dasgupta2
1 NXP Semiconductors
2 CALCE, University of Maryland, College Park, MD, USA


This work aims to implement a new modeling technique that does consider the grain structure of solder interconnects for simulation of material fatigue and damage at cyclic thermomechanical load. It is based on a continuum model for anisotropic steady-state creep that was recently developed at CALCE/ University of Maryland [1]-[2]. We will briefly recap the major steps that were taken to derive anisotropic Hill-Garofalo constitutive relations from a crystal-viscoplastic (CV) approach. The Hill-Garofalo model will be presented in detail and a simple benchmark model will be proposed. The benchmark model will then be applied for verification of finite element analysis (FEA) code implementation. FEA is then used to simulate a solder interconnect with explicitly modeled microstructure. Simulation results will be discussed, conclusions and suggested future work will be shared.

This article is available online here and to CALCE Consortium Members for personal review.

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