Torsten Hauck1, Michiel Van Soestbergen1, Qian Jiang2, Abhishek Deshpande2, Aniket Bharamgonda2, and Abhijit Dasgupta2
1 NXP Semiconductors
2 CALCE, University of Maryland, College Park, MD, USA
This work aims to implement a new modeling technique that does consider the grain structure of solder interconnects for simulation of material fatigue and damage at cyclic thermomechanical load. It is based on a continuum model for anisotropic steady-state creep that was recently developed at CALCE/ University of Maryland -. We will briefly recap the major steps that were taken to derive anisotropic Hill-Garofalo constitutive relations from a crystal-viscoplastic (CV) approach. The Hill-Garofalo model will be presented in detail and a simple benchmark model will be proposed. The benchmark model will then be applied for verification of finite element analysis (FEA) code implementation. FEA is then used to simulate a solder interconnect with explicitly modeled microstructure. Simulation results will be discussed, conclusions and suggested future work will be shared.
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