Journal of Electronic Packaging, 142(1): 011002, March 2020.

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part II Implementation of Stochastic Model

H.-P. Wei, Y.-H. Yang, and B. Han
Mechanical Engineering Department, University of Maryland, College Park, MD 20742, USA


The stochastic model for yield loss prediction proposed in Part I is implemented for a package-on-package (PoP) assembly. The assembly consists of a stacked die thin ?at ball grid array (TFBGA) as the top package and a ?ip chip ball grid array (fcBGA) as the bot-tom package. The top and bottom packages are connected through 216 solder joints of 0.5 mm pitch in two peripheral rows. The warpage values of the top and bottom package are calculated by ?nite element analysis (FEA), and the corresponding probability of density functions (PDFs) are obtained by the eigenvector dimension reduction (EDR) method. The solder ball heights of the top and bottom package and the corner pad joint heights are determined by surface evolver, and their PDFs are determined by the EDR method, too. Only 137 modeling runs are conducted to obtain all 549 PDFs in spite of the large number of input variables considered in the study (27 input variables). Finally, the noncontact open-induced staking yield loss of the PoP assembly is predicted from the PDFs.

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