Experimental Mechanics, vol. 59, no. 7, pp. 1075-1086, 2019.

Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

B. Wua, Y.-H. Yanga, B. Hana and J. Schumacherb
aMechanical Engineering Department, University of Maryland, College Park, MD 20742, USA
bCenter for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA


A novel E-shaped symmetric configuration is proposed and implemented to document deformation evolutions of single-grain solder joints with different orientations. The configuration is fabricated from two metals with different coefficient of thermal expansions to produce precisely-controlled shear-dominant loading to solder joints when subjected to a thermal excursion. Cooling rates during solder solidification are controlled to produce joints with a large single grain of Sn-based Pb-free solder. Moiré interferometry is employed to measure the detailed in-situ deformations of single grain solder joints during a thermal cycle of −40 °C to 125 °C. The results are analyzed to provide the history of grain orientation-dependent inelastic strain evolutions. The results are aimed at calibrating and verifying the anisotropic constitutive models developed for Sn-based Pb-free solder alloys.

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