Yan Ning 1, Michael Azarian 1, and Michael Pecht 1
1 CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
High-density interconnect printed circuit boards and
substrates are widely used for high-end electronics to meet the
demand of greater I/O density and smaller footprint area.
Microvias as electrical interconnections between circuit layers
have much smaller scale (no larger than 150 µm in diameter)
compared to conventional plated-through holes, and require a
different fabrication process that introduces unique reliability
challenges. This study identifies factors that affect microvia
fatigue life and presents a design of experiments to quantify the
effects of those factors on microvia life in terms of cycles-to-failure.
A regression life prediction model is formulated to account for the
significant design, material, and defect parameters.