IEEE Access, Preprint, February 7, 2019, DOI: 10.1109/TDMR.2019.2898179

Development of a Microvia Fatigue Life Model Using a Response Surface Method

Yan Ning 1, Michael Azarian 1, and Michael Pecht 1
1 CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA


High-density interconnect printed circuit boards and substrates are widely used for high-end electronics to meet the demand of greater I/O density and smaller footprint area. Microvias as electrical interconnections between circuit layers have much smaller scale (no larger than 150 ┬Ám in diameter) compared to conventional plated-through holes, and require a different fabrication process that introduces unique reliability challenges. This study identifies factors that affect microvia fatigue life and presents a design of experiments to quantify the effects of those factors on microvia life in terms of cycles-to-failure. A regression life prediction model is formulated to account for the significant design, material, and defect parameters.

This article is available online here and to CALCE Consortium Members for personal review.

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