Meixian Jiang 1, Guanghua Wu 2, Diganta Das 2, and Michael Pecht 2
1College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
2 CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
Abstract:
This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging.