Meixian Jiang 1, Guanghua Wu 2, Diganta Das 2, and Michael Pecht 2
1College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
2 CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging.