IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, DOI: 10.1109/TCPMT.2018.2816259

In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor


Alexandru Prisacaru1, Alicja Palczynska1, Przemyslaw Gromala1, Andreas Theissler2, Bongtae Han3, Guo Qi Zhang1
1Robert Bosch GmbH, Division of Automotive Electronics, Stuttgart, Germany
2University of Applied Sciences, Aalen
3CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
4Chinese Academy of Sciences, Beijing, China

Abstract:

Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systems much more complex than those realized in the past. The automotive industry has been forced to adopt advanced consumer electronics to satisfy the demand, and thus it becomes more challenging to assess system reliability while adopting the new technologies. The system-level reliability can be enforced by implementing a process called condition monitoring. In this paper, a piezoresistive silicon-based stress sensor is implemented to recognize in situ failure in outer molded electronic control units subjected to reliability testing conditions. The test vehicle consists of six double decawatt package power packages and three stress sensors mounted on a printed circuit board. A unique algorithm is proposed and implemented to handle the data obtained from the piezoresistive stress-sensing cells. The accuracy of measured data is examined by finite-element method, and the physical changes are validated with scanning acoustic microscope. Oneclass support vector machines are used to autonomously classify data based on a training set of measurements from healthy state, and the reported results confirm that robust classification is possible based on data from the silicon stress sensor

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