Microelectronics Reliability 74 (2017) 121130

Viscoplastic properties of pressure-less sintered silver materials using indentation


D. Leslie, A. Dasgupta, Carlos Morillo
e CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742, USA

Abstract:

This paper focuses on using a combination of indentation and FEA methods for characterizing the viscoplastic behavior of heterogeneousmaterials which pose additional challenges because of the non-uniform morphology. In particular, the paper focuses on two forms of pressure-less sintered silver interconnect materials: an adhesivebased particulate composite for low temperature applications and a porous sintered version for high-temperature applications. By using two different post-processing methods (an analytic approach and a computational FEA approach) for the indentation results, we obtain lower and upper estimates to the viscoplastic properties for both of these heterogeneous morphologies. Two types of indenters, spherical and Berkovich, and two types of indentation tests, constant load and constant strain rate, are compared, with regard to their ability tomeasure the viscoplastic properties of heterogeneous materials.

This article is available to CALCE Consortium Members for personal review.



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