Microelectronics Reliability, Volume 63, Pages 134-141, 29 June 2016

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Kenny Mahana, Byung Kima, Bulong Wua, Bongtae Hana, Ilho Kimb, Hojeong Moonb, and Young Ham Hwangc
a CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
b Package Development Team, Semiconductor R&D Center, Samsung Electronics, 1, Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, Korea
c Measurement and Analysis group, Corporate R&D Institute, Samsung Electro-Mechanics Co., 150, Maeyoung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Korea


We propose and implement an adhesion test configuration called “modified single cantilever adhesion test” (MSCAT) that can be employed to determine the adhesion strength of epoxy molding compound (EMC) and photo solder resist (PSR) interface in thin semiconductor packages. The proposed M-SCAT method is optimal for quick and quantitative in-situ testing of the interface with strong adhesion as sample preparation and testing are simple while maintaining a low mode mixity at the crack tip. Detailed sample preparation and experimental testing to determine the critical load required for delamination are presented. A numerical procedure is followed to assess the stress and strain fields around the crack tip at the point of delamination, thus allowing for the J-integral method to be employed to determine the critical energy release rate. The proposed approach is carried out for two different EMC/PSR interfaces. The results show excellent repeatability, which allows for the test method to be used effectively to select the most ideal material set for given applications

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