Dae-Suk Kima and Bongtae Han a
a CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
Abstract:
The effect of junction temperature on heat dissipation of high power light emitting diodes (LEDs)
is investigated. The theoretical aspect of junction temperature dependency of two major
parameters—the forward voltage and the radiant flux—on heat dissipation is reviewed. Actual
measurements of the heat dissipation over a wide range of junction temperatures are followed to
quantify the effect of the parameters using commercially available LEDs. The results show that (1)
the effect of the junction temperature dependency on heat dissipation is governed largely by the
LED power efficiency and (2) each parameter contributes to the total heat dissipation in an
opposite way so that the absolute changes of the heat dissipation are not significant over a wide
range of junction temperature. An empirical model of heat dissipation is proposed for applications
in practice.
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