Michael Pechta, b, 1, Tadahiro Shibutanic, Myeongsu Kangb, Melinda Hodkiewiczd, Edward Crippse
a IEEE, USA
b CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
c National University, Yokohama 240-8501, Japan
d School of Mechanical and Chemical Engineering, University of Western Australia, Crawley, WA, Australia
e School of Mathematics and Statistics, University of Western Australia, Crawley, WA, Australia
Abstract:
The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth
has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately,
however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck
for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering
the time with reliability issues during qualification testing, this paper provides a review of conventional
methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology
that combines the advantages of physics-of-failure and data-driven methods.
Keywords: Microelectronics, Physics-of-failure, Prognostics, Qualification testing, Reliability