Journal of Electronic Materials, Volume 43, pp 3885-3897, November 2014

Review of Capabilities of the ENEPIG Surface Finish

Menahem Ratzker, Adam Pearl, Michael Osterman, Michael Pecht and George Milad

Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD 20742, USA.
Uyemura International Corporation, Southington, CT 06489, USA.


Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solder-able surface on which to mount electronic components. While it is true that some people have called electro-less nickel electro-less palladium immersion gold (ENEPIG) a “universal finish” for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.

Complete article available from the publisher and to the CALCE Consortium Members.

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