IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, No. 4, April 2014, Pages 569-580

Experiment and Simulation of Board Level Drop Tests With Intentional Board Slap at High Impact Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, and Abhijit Dasgupta

Center for Advanced Life Cycle Engineering (CALCE), University of Maryland


This paper explores multiple impacts generated through fixture design to induce high accelerations in board level drop testing. Drop tests were conducted at accelerations as high as 30 000 G using mechanical accelerators. Finite element analysis simulations were used to determine impact locations and acceleration magnitude. Wafer level chip scale package components were tested at the board level at accelerations ranging from 10 000 to 30 000 G. The clearance between the printed circuit board assembly and the fixture are parametrically varied in the investigation to understand the effects of the clearance. Experiments and simulation show interesting results due to dynamic modal interaction.

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