46th International Symposium on Microelectronics, Orlando, September 30 - October 3, 2013

Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects

Sandeep Menon, Adam Pearl, Michael Osterman, and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20740, USA

Abstract:

Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate loading conditions. In this study, durability of solder interconnects formed between BGAs and electro-less nickel, electro-less palladium, immersion gold (ENEPIG) finished pads assembled using SnPb and SAC305 solders under harmonic vibration loading is examined. ENEPIG test specimens with two thicknesses of palladium were evaluated. Isothermal preconditioning levels at 100C for 24 hrs and 500 hrs were included to evaluate the impact of inter-metallic evolution on the durability of the soldered interconnects. For comparison, tests specimens created with immersion silver (ImAg) finished printed wiring boards were also included. The failure data obtained found the durability of interconnects formed with ENEPIG finish was comparable or better durability than the durability of interconnects formed with ImAg finish irrespective of the solder. The tests indicate that the use of a thicker palladium layer reduced the degradation in durability which occurred from isothermal ageing.

Complete article is available from the publisher and to the CALCE Consortium Members.



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