Abstract:

Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behaviour of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micro-mechanics, residual stress, composite materials, fracture mechanics, and bio-mechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

Keywords: Moire interferometry , Microelectronics devices , Material characterization , Micro-mechanics , Residual stress , Composite materials , Fracture mechanics , Bio-mechanics.

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