IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 4, Pages 698-712, December 2010

Direct Sub-mount Cooling of High-Power LEDs

Dae-Whan Kim1, Emil Rahim2, Avram Bar-Cohen2 and Bongtae Han2

1Digital Media and Communication Research and Development Center, Samsung Electronics Company, Ltd.
2Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA


Rapidly increasing light emitting diode (LED) heat fluxes necessitate the development of aggressive thermal management techniques that can intercept the dissipated heat directly in the sub-mount. Micro-gap coolers, which eliminate solid–solid thermal interface resistance and provide direct contact between chemically inert, dielectric fluids and the back surface of an active electronic component, offer a most promising approach for cooling high-power LEDs. This paper focuses on the two-phase thermo-fluid characteristics of a dielectric liquid, FC-72, flowing in an asymmetrically heated chip-scale micro-gap channel, 10 mm wide × 37 mm long, with channel heights varying from 110μm to 500μm and channel wall heat fluxes of 200 kW/m2. The experimental two-phase, area-averaged heat transfer coefficients of FC-72 reached 10 kW/m2·K, significantly higher than the single-phase FC-72 values, thus providing cooling capability in the range associated with water under forced convection. Data obtained for single-phase water yielded very good agreement with predictions for the convective heat transfer coefficients and served to validate the accuracy of the experimental apparatus and measurement technique. It is shown that this two-phase cooling approach could be used to dissipate in excess of 600 kW/m2 in the sub-mount of high-power LEDs.

Index Terms: FC-72, flow regime map, LED, micro-gap channel.

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