Preeti Chauhan a, Michael Osterman a, Michael Pecht a, and Qiang Yu b
aCenter for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA
bYokohama National University, Yokohama, Japan
Solder interconnects are often the most critical components in electronic assemblies during their operational life. Health assessment of solder interconnects assists in monitoring the degradation of electronic components and predicting their failure. This paper demonstrates the use of temperature as a health assessment tool for implementing prognostics and health management in electronic components. The degradation in varistor solder interconnects due to thermal fatigue damage is assessed using temperature rise. A constant current of 5 amps is passed through the components and the temperature across the solder interconnects is monitored. The temperature rise in the components is found to be directly proportional to the damage undergone by the components due to thermal fatigue. The temperature can thus be used as a means to assess the damage, enabling the health monitoring of the components.
Complete Article is available from the publisher and to CALCE consortium members.
© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.