IEEE Transactions on Device and Materials Reliability, Volume 12, Issue 02, Pages 482 - 493, June 2012

MEMS Reliability Review

Y. Huang, A. Sai Sarathi Vasan, R. Doraiswami, M. Osterman and M. Pecht
CALCE Electronic Products and Systems, University of Maryland, College Park, MD 20742, USA


Micro electro-mechanical systems (MEMS), represents a technology that integrates miniaturized mechanical and electro-mechanical components (i.e., sensors and actuators) that are made using micro-fabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

Complete article is available from the publisher and to the CALCE consortium members.

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