Proc. of IPC Apex Expo Conference, Las Vegas, NV, April 12-14, 2011

Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy

Xiaofei He, Michael H. Azarian, Chunsheng Wang and Michael G. Pecht

CALCE, Department of Mechanical Engineering, University of Maryland, College Park
Department of Chemical and Biomolecular Engineering, University of Maryland, College Park, MD 20742 USA
Prognostics and Health Management Center, City University of Hong Kong, Kowloon, Hong Kong


The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures. Different from this, an AC impedance measurement has been used to evaluate the kinetics of electrochemical migration process and provide detailed information about cell parameters such as solution resistance, charge transfer resistance, and double layer charging capacitance during dendritic growth. The solution resistance and charge transfer resistance decreased during the dendritic growth, while the double layer charging capacitance showed an oscillating nature. The dramatic changes of these parameters due to dendritic growth may be used as forerunner signals prior to dendritic growth and developed as a prognosis technique. A physicochemical model was fitted into the experimental results and a simulation was conducted. The simulation results confirmed the experimental data.

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