Proceedings from the 36th International Symposium for Testing and Failure Analysis November 14–18, 2010, Addison, Texas, USA

Methodology for Analysis of Schottky Diode Failures

Bhanu P. Sood and Michael Pecht
Center for Advanced Life Cycle Engineering
University of Maryland
College Park, MD 20742 USA

John Miker and Tom Wanek
Emerson Network Power
Lorain, OH 44052


Schottky diodes are semiconductor switching devices with low forward voltage drops and very fast switching speeds. This paper provides an overview of the common failure modes in Schottky diodes and corresponding failure mechanisms associated with each failure mode. Results of material level evaluation on diodes and packages as well as manufacturing and assembly processes are analyzed to identify a set of possible failure sites with associated failure modes, mechanisms, and causes. A case study is then presented to illustrate the application of a systematic FMMEA methodology to the analysis of a specific failure in a Schottky diode package.

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