Tadahiro Shibutani
Yokohama National University
Yokohama, Japan
Michael Osterman, Member, IEEE
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742
Michael Pecht,
Fellow, IEEE
City University of Hong Kong
Hong Kong, China
and
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742
Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.
Index Terms: Environmental test, lead-free electronics, standard, tin whisker.
Complete article is available to CALCE Consortium Members.
© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.