IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, pp. 216-219, March 2009

Standards for Tin Whisker Test Methods on Lead-Free Components

Tadahiro Shibutani
Yokohama National University
Yokohama, Japan

Michael Osterman, Member, IEEE
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742

Michael Pecht, Fellow, IEEE
City University of Hong Kong
Hong Kong, China
and
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742

Abstract:

Tin whiskers are widely recognized as being a reliability threat to lead-free electronic components. The current standards to assess the tin whisker susceptibility of lead-free finishes in electronic components are problematic. Key problems include lack of data collection, lack of agreement on proper techniques for measuring whisker length, lack of established acceleration transforms for prescribed tests, and disagreement over acceptance criteria. This paper overviews the tin whisker standards and then describes the problems listed above. Recommendations for improvements are then presented and discussed.

Index Terms: Environmental test, lead-free electronics, standard, tin whisker.

Complete article is available to CALCE Consortium Members.

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