Capacitor and Resistor Technology Symposium (CARTS), Jacksonville, FL, 2009

Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress

Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
1103 Engineering Lab Building
University of Maryland, College Park, MD 20742


In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125°C and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.

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